Simulation of the effect of sintering on the integrity of diamond grains in grinding wheels

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Published Mar 14, 2014
Citation Analysis

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A.I. Grabchenko
M.F. Semko Department of Integrated Engineering Techniques, National Technical University Kharkov Polytechnic Institute, Kharkov, Ukraine
D.V. Romashov
M.F. Semko Department of Integrated Engineering Techniques, National Technical University Kharkov Polytechnic Institute, Kharkov, Ukraine
D.O. Fedorenko
M.F. Semko Department of Integrated Engineering Techniques, National Technical University Kharkov Polytechnic Institute, Kharkov, Ukraine
A.G. Mamalis
Project Centre for Nanotechnology and Advanced Engineering, NCSR Demokritos, Athens, Greece
D. Lagoudas
Aerospace Engineering Department, Texas A And M University, College Station, TX, United States
V.A. Fedorovich
M.F. Semko Department of Integrated Engineering Techniques, National Technical University Kharkov Polytechnic Institute, Kharkov, Ukraine
T. Baxevanis
Aerospace Engineering Department, Texas A And M University, College Station, TX, United States

Abstract

This paper focuses on theoretical studies of the process of manufacturing diamond abrasive tools and of diamond grinding through 3D modelling of the stress–strain state of the components of the diamond layer of the grinding wheel. Modelling of the sintering process of diamond grinding wheels with metal-based binders is used in order to determine the conditions needed to maintain the integrity of the diamond grains in the diamond layer.

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Issue
Vol. 10 No. 1 (2014)
Section
Articles